Die Attach Adhesives (conductive, heat-curing type)
Die Attach Adhesives applications
Key Features
These conductive adhesives are heat-cured to accommodate various applications, including die bonding, lead bonding, and high thermal conductivity.
Property Data
| Product Number |
Characteristics | Applications | Viscosity [Pa･s] |
Application Method |
Curing Conditions |
Volume Resistivity [Ω･cm] |
Adhesive Strength [N/mm2] |
Thermal Conductivity [W/mK] |
|---|---|---|---|---|---|---|---|---|
| H 9607 | Good adhesion at high temperature |
Bonding for Au or Ag plating lead frame | 25 (E type2.5rpm) | Dispensing Transferring |
150℃, 120min | 1.5×10-4 | 16 | 10 |
| H 9683 | High thermal conductivity Excellent adhesive strength Void free |
QFP, QFN | 25 (E type2.5rpm) | Dispensing | 150℃, 60min | 0.5×10-4 | 18 | 11 |
| H 9800 | Non-bleeding Good adhesion at high temperature |
QFP, QFN | 16 (E type5rpm) | Dispensing | 150℃, 30min | 7.0×10-3 | 45 | 2 |
| H 9940 | High thermal conductivity High reliability |
QFP, QFN | 30 (HBT 10rpm) | Dispensing | 25 -> 200C for 30min 200℃, 15min |
4.5×10-5 | 13 | 12 |
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