06/18/2024 Information

An engineer from NAMICS Co., Ltd., headquartered in Kita-ku, Niigata City, has been honored with the “Technology Award”
from the Japan Institute of Electronics Packaging (JIEP) for the development of the “Practical Application of Liquid Compression Mold Underfill.”
This prestigious award is bestowed by the academic society to acknowledge technologies that significantly advance the field of electronics packaging technology.

Liquid Compression Mold Underfill (LCMUF) is an encapsulation materials used for current advanced semiconductor packages. It can simultaneously encapsulate the gap between an interposer and chips, as well as the peripheral parts of the chips, in a single step using compression molding equipment.
At this time, we successfully developed an LCMUF with excellent physical properties through design optimization of the resin and the filler. The LCMUF we developed enables a balance between warpage reduction and high flowability thanks to these optimizations.
As a result, we have been able to commercialize our LCMUF for mass production. We are striving to continue developing new LCMUF materials better accommodate further advanced semiconductor packages in the future.

*LCMUF was developed with the cooperation of Resonac Corporation headquartered in Tokyo for material evaluation.

 

 

Link
The Japan Institute of Electronics packaging (JIEP)
https://jiep.or.jp/index.php