Air-curable Conductive Copper Pastes
Key Features
Heat curing conductive material with copper filler
Excellent conductivity at air-curing
Better performance than materials with silver filler in;
- Migration resistance
- Stability of material cost
Lineup
- XCH9207 Series
Low viscosity and low thixotropy paste
Suitable for various applications, especially dipping - XCH9207P Series
High viscosity and high thixotropic paste
Suitable for various applications, especially screen-printing
Property Data
| Copper Filler Diameter [μm] | Curing Conditions | Viscosity [Pa·s] | Specific Resistance Value[Ω·cm] | |
|---|---|---|---|---|
| XCH9207 | 5 | 200 ℃, 30 min. | 40 | 3×10-5 |
| XCH9207P | 5 | 200 ℃, 30 min. | 200 | 6×10-5 |
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CONTACT
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