CSP/BGA Board Level Underfills (encapsulants)
CSP/BGA Board Level Underfill applications
Key Features
CSP/BGA Board Level Underfill is used for filling and sealing spaces by capillary action when doing secondary mounting of Packaged Chips to a Motherboard. CSP/BGA Board Level Underfill material improves thermal cycle performance and enhances impact resistance (drop-test qualification).
Property Data
| Product Number | Characteristics | Viscosity [Pa･s] |
Tg [℃] |
Modulus of Elasticity [GPa] |
C.T.E ≦Tg [ppm] |
C.T.E ≧Tg [ppm] |
|---|---|---|---|---|---|---|
| SUF 1589-1 | High reliability, High throughput | 10.0 | 120 | 13.0 | 23 | 80 |
| SUF 1570-2 | High reliability, High throughput | 40.0 | 135 | 8.0 | 32 | 100 |
| XSUF1594-16 | Repairable, High throughput | 0.3 | 120 | 4.1 | 53 | 175 |
Related Products
CONTACT
For inquiries or consultation regarding our products, please contact us on the following page.