Sintering-type Pastes for Terminal Electrodes of Passive Components (HIMEC)

Pastes for Terminal Electrodes of Passive Components applications

Key Features

These electro-conductive pastes are sintered to suit specific processes, and are used for terminal electrodes of passive components for surface mounting, such as resistors, MLCCs and inductors. We are working to achieve lead-free products.

Property Data

Product Number Characteristics Applications Filler Application Method Sintering
Conditions
DP4000 series High density,
Good plating solution resistance,
Lead-free
Chip inductor,
Chip varistor,
Chip thermistor,
LTCC,
Chip resistors
Ag Dipping method 600~750℃
SR4000 series Good breakage properties,
Good plating solution resistance,
Lead-free
Chip resistors Ag Screen printing 800~900℃
SR5000 series Good ohmic contact,
Good solderability,
Lead-free
PTC thermistors Ag Screen printing 550~650℃
6000 series High reliability,
Good plating solution resistance,
Lead-free
MLCC Cu Dipping method 800~900℃

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CONTACT

For inquiries or consultation regarding our products, please contact us on the following page.

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