Highly Thermally Conductive TIM
Key Features
Highly thermally conductive TIM, Thermal Interface Material, was newly developed. This heat-curing conductive paste is suitable for applications including power modules for EV and industrial instruments and advanced semiconductor packages for ADAS (Advanced driver-assistance systems) for automobiles and data centers/servers. The paste has excellent performance for high conductivity, 70 W/mk after curing, ensuring efficient heat conductivity inside electronic components. The paste is also designed to provide low elastic modulus property after curing to accommodate increasing size of modules and semiconductor packages.
Outline of Benefits
- Highly thermally conductive heat curing paste with excellent heat conductivity
- Dispensable
- Accommodates larger-area adhesion application featuring low elastic modulus property after curing
Property Data
| High thermal conductivity TIM | ||
|---|---|---|
| Viscosity | 80 - 90 Pa・s @ 25℃ | |
| Curing condition | - | 180℃/60 min |
| Thermal conductivity （Laser flash method） |
3 layer Si/Cu |
70 W/mK |
| Storage modulus | - | 1.0 GPa @ 25℃ |
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CONTACT
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