Flip Chip Underfills (encapsulants)
Flip Chip Underfill applications
Key Features
Flip Chip Underfill is an insulating material used in mounting technologies involving direct electrical connections. Underfill flows by capillary action into the gap between an IC chip circuit with conductive bumps and a mounting board by capillary action.
Namics has developed an extensive lineup of products in response to the demands towards of flip chip packaging. Some typical applications include CPU, LSI, and Graphic Devices. Custom formulated materials are also available for user specific applications.
Property Data
| Product Number |
Characteristics | Viscosity [Pa･s] |
Tg [℃] |
Modulus of Elasticity [GPa] |
C.T.E ≦Tg [ppm] |
|---|---|---|---|---|---|
| U8443-14 | Low viscosity; for tight spaces | 10 | 135 | 6.5 | 42 |
| U8410-73C | For low K, Pb-free bumps and tight spaces |
50 | 88 | 11.5 | 31 |
| U8410-73CF3 | For low-K, Cu-pillar and Pb-free bumps and tight spaces |
33 | 88 | 8.8 | 31 |
| U8410-99 | For low-K, Pb-free bumps | 50 | 100 | 11 | 29 |
| U8410-302 | For low-K, Cu-pillar and Pb-free bumps |
55 | 95 | 12 | 22 |
| U8410-377 | Low viscosity; for tight spaces | 15 | 128 | 8.6 | 30 |
| U8439-1 | For low K and large ICs | 60 | 70 | 8 | 36 |
| U8439-105 | For low K, large ICs and tight spaces | 55 | 70 | 8.5 | 34 |
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