Substrates / Wirings
A range of wiring materials and insulating adhesive films for electronic substrates is available.
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Substrates / Wirings Cu Substrate Surface Roughening Treatment (CuTAP)
This product is currently under development. For more information, please refer to Research and Deve…
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SMT (passive components / mounting materials) Application-specific Ag Pastes
Key Features A paste with a high resistance to soldering heat can be used as an alternative for appl…
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Substrates / Wirings Heat-curing Low Resistance Wiring Pastes
Key Features With a specialized conductive filler in the electrode, this heat-curing wiring paste is…
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Substrates / Wirings Cu Pastes for Printed Circuits and Thick Layer Printing for Ceramic Substrates
Key Features A high-temperature sintering type copper paste is designed to form printed circuits on …
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Substrates / Wirings Air-curable Conductive Copper Pastes
Key Features Heat curing conductive material with copper filler Excellent conductivity at air-curing…
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Substrates / Wirings Heat-curing Solar Cell Surface and Back Electrode Agents (UNIMEC)
Pastes for Electrodes on the Back / Front of Solar Cells applications Key Features These electro-con…
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Power Modules Low Modulus Thermal Conductive Film for Metal Base Substrate
Key Features Suitable for applications that require heat dissipation, such as power module, and auto…
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Substrates / Wirings Adhesive Films for Machines and Measuring Devices
Key Features This is an unreacted thermosetting resin film which controls fluidity . This insulating…
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