A range of high thermal conductivity die attach adhesives for power modules and high thermal conductivity insulating films is available.

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  Power Modules Highly Thermally Conductive TIM

  Key Features Highly thermally conductive TIM, Thermal Interface Material, was newly developed. This …

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  Power Modules Die Attach Adhesives (conductive, heat-curing type)

  Die Attach Adhesives applications Key Features These conductive adhesives are heat-cured to accommod…

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  Power Modules Low-temperature-sintering High thermal-conductivity Die Attach Adhesives Using MO Technology (conductive, sintering type)

  Key Features Low-temperature sintered high thermally conductive die attach pastes using MO technolog…

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  Substrates / Wirings Low Modulus Thermal Conductive Film for Metal Base Substrate

  Key Features Suitable for applications that require heat dissipation, such as power module, and auto…

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