CHIPCOAT

• Corner / Edge Bonding Pastes
• Chip-on-Film Underfills (encapsulants)
• Flip Chip Underfills (encapsulants)
• Dam-and-Fill Encapsulants
• CSP/BGA Board Level Underfills (encapsulants)
• Camera Module Adhesives
• Low-temperature Curing Adhesives

UNIMEC: Heat-curing-type Conductive Paste

• Heat-curing Low Resistance Wiring Pastes
• Electromagnetic Interference (EMI) Shielding Paste
• Air-curable Conductive Copper Pastes
• Surface Mounting Adhesives
• Pastes for Terminal Electrodes of Passive Components (UNIMEC)
• Die Attach Adhesives (conductive, heat-curing type)
• Heat-curing Solar Cell Surface and Back Electrode Agents (UNIMEC)
• Low-temperature-sintering High thermal-conductivity Die Attach Adhesives Using MO Technology (conductive, sintering type)

HIMEC: Sintering-type Conductive Paste

• Application-specific Ag Pastes
• Cu Pastes for Printed Circuits and Thick Layer Printing for Ceramic Substrates
• Sintering-type Pastes for Terminal Electrodes of Passive Components (HIMEC)
• Sintering-type Pastes for Internal Electrodes of Passive Components (HIMEC)

OVERCOAT

• Chip Resistor Protective Coatings

KINOMEC: Stretchable Pastes

• Stretchable Pastes (KINOMEC)

ADFLEMA

• Low-dielectric adhesive film for high-frequency substrates
• Low Modulus Thermal Conductive Film for Metal Base Substrate
• Adhesive Films for Machines and Measuring Devices

Sealing Glass

• Low-temperature Sealing Glass

Metal Organic (MO) Technology

• Low-temperature Sintered Conductive Pastes Using MO Technology

New Products

• Highly Thermally Conductive TIM
• Electromagnetic Interference (EMI) Shielding Paste
• Air-curable Conductive Copper Pastes